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Applied Materials and Besi to advance chip integration technology

Applied Materials and Besi to advance chip integration technology

Applied Materials Inc., the U.S-based one of the leading companies offering materials engineering solutions for the semiconductor industry, has reportedly partnered with Dutch firm BE Semiconductor Industries N.V to develop the industry’s first proven equipment solution for die-based hybrid bonding. It is an evolving chip-to-chip interconnect technology that allows subsystem designs and heterogeneous chip for next-generation applications including high-end computing, 5G, and Artificial Intelligence.

In recent years, as 2D scaling slows, the semiconductor companies are transitioning towards chip integration and heterogeneous design as a new way to deliver improvements in performance, power, area, cost, and time to market (PPACt). To boost this trend, Applied Materials and Besi have created a joint development program and are developing a Center of Excellence focused on cutting-edge chip-to-chip hybrid bonding technology. The program leverages both companies’ respective front-end and back-end semiconductor expertise to offer co-optimized die-based integrated hybrid bonding configurations and equipment solutions for clients.

Speaking on the agreement, Nirmalya Maity who is the Corporate Vice President for Advanced Packaging at Applied Materials said that challenges in traditional Moore’s Law scaling are damaging the economics and pace of the semiconductor sector’s roadmap. Applied’s partnership with Besi and the development of the Hybrid Bonding Center of Excellence are major factors of the company’s strategy to provide customers with a ‘New Playbook’ for accelerating improvements in PPACt, he stated.

Mr. Maity added that the company is looking forward to collaborating with Besi to co-optimize the company’s equipment offerings and boost cutting-edge heterogeneous integration technology for its customers.

Ruurd Boomsma CTO at Besi the company is excited to create this joint development program with Applied Materials which combines the semiconductor sector’s leading materials engineering and cutting-edge packaging technologies for customers.

He added that the partnership can greatly boost  proliferation and adoption of hybrid bonding for cutting-edge AI, 5G, high-performance computing, and automotive and data storage applications.

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Sunil Jha

Sunil Jha has been a part of the content industry for close to two years. Having previously worked as a voice over artist and sportswriter, he now focuses on writing articles for, across a slew of topics, ranging from technology to trade and finance. With a business-oriented educational background, Sunil brings forth the expertise of deep-dive research and a strategic approach in his write ups.